186 ROSIN FLUX;FLUX IS MOISTURE AND FUNGUS RESISTANT;DESIGNED FOR WAVE/DRAG SOLDERING OF SINGLE SIDED/DOUBLE SIDED/MULTI-LAYER CIRCUIT BOARD ASSEMBLIES;USED FOR SOLDERING MULTI-LAYER ASSEMBLIES WHICH REQUIRE A HIGH PREHEAT TEMPERATURE;USED IN FOAM FLUXING EQUIPMENT;SPECIFIC GRAVITY AT 75 DEG. F;FLASH POINT 65 DEG. F;SOLDER SPREAD FACTOR 95 MM